New tuck point blades from Diamond Back

The new Wafer Style Tuck Point Blades from Multiquip’s Diamond Back Diamond Cutting Division boast excellent grinding speeds an inexpensive price. Eight wafer tuck blades CIRCLE #58 ON READER SERVICE CARD are offered, with double and triple style models ranging in diameter from 4 to 7 inches and in thickness from 1⁄4" to 3⁄8" inch. With their streamlined blade thickness, operators can easily remove damaged grout and mortar between bricks and in concrete blocks in foundation walls in less than half the time of a conventional tuck blade. Fresh mortar can then be reapplied to strengthen and restore the surface to its original finish. The blade can be used with most right-angle grinders.

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