The new Wafer Style Tuck Point Blades from Multiquip’s Diamond Back Diamond Cutting Division boast excellent grinding speeds an inexpensive price. Eight wafer tuck blades CIRCLE #58 ON READER SERVICE CARD are offered, with double and triple style models ranging in diameter from 4 to 7 inches and in thickness from 1⁄4" to 3⁄8" inch. With their streamlined blade thickness, operators can easily remove damaged grout and mortar between bricks and in concrete blocks in foundation walls in less than half the time of a conventional tuck blade. Fresh mortar can then be reapplied to strengthen and restore the surface to its original finish. The blade can be used with most right-angle grinders.